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Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints
Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints
Adhesive strength and tensile fracture of Ni particle enhanced Sn-Ag composite solder joints
Lee, H. T. (author) / Lee, Y. H. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 419 ; 172-180
2006-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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