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Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects
Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects
Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects
Kim, H. (Autor:in) / Koseki, T. (Autor:in) / Ohba, T. (Autor:in) / Ohta, T. (Autor:in) / Kojima, Y. (Autor:in) / Sato, H. (Autor:in) / Hosaka, S. (Autor:in) / Shimogaki, Y. (Autor:in)
APPLIED SURFACE SCIENCE ; 252 ; 3938-3942
01.01.2006
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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