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Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects
Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects
Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects
Kim, H. (author) / Koseki, T. (author) / Ohba, T. (author) / Ohta, T. (author) / Kojima, Y. (author) / Sato, H. (author) / Hosaka, S. (author) / Shimogaki, Y. (author)
APPLIED SURFACE SCIENCE ; 252 ; 3938-3942
2006-01-01
5 pages
Article (Journal)
English
DDC:
621.35
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