Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Flip Chip Technology: Mainstream at Last
Coderre, J. (Autor:in)
ADVANCED PACKAGING ; 15 ; 16-19
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2008
Flip Chip Attach Alternatives: Advances in Bump Technology
British Library Online Contents | 2005
|Next-generation Electronics Packaging Using Flip Chip Technology
British Library Online Contents | 2003
|British Library Online Contents | 2001
|Tin-lead (SnPb) solder reaction in flip chip technology
British Library Online Contents | 2001
|