Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Jang, J.-W. / De Silva, A. P. / Lin, J.-K. et al. | British Library Online Contents | 2004

Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Liu, Y.-H. / Lin, K.-L. | British Library Online Contents | 2005

Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G. | British Library Online Contents | 2003

Compatibility of the Lead(Pb)-free Package to the SnPb Solder

Kim, N. S. / Kim, M. I. / Kim, D. K. et al. | British Library Conference Proceedings | 2001

Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization

Chen, H.-Y. / Chen, C. | British Library Online Contents | 2010