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Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction
Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction
Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction
Zhao, H. Q. (Autor:in) / Yu, L. J. (Autor:in) / Huang, Y. Z. (Autor:in) / Wang, Y. T. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 133 ; 117-123
01.01.2006
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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