Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Nondestructive and Non-Contact Characterization Technique for Metal Thin Films Using a Near-Field Microwave Microprobe
Nondestructive and Non-Contact Characterization Technique for Metal Thin Films Using a Near-Field Microwave Microprobe
Nondestructive and Non-Contact Characterization Technique for Metal Thin Films Using a Near-Field Microwave Microprobe
Yoo, H. J. (Autor:in) / Kim, J. C. (Autor:in) / Babajayan, A. (Autor:in) / Kim, S. H. (Autor:in) / Lee, K. J. (Autor:in) / Lee, S.-S. / Lee, J. H. / Park, I. K. / Song, S.-J. / Choi, M. Y.
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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