Investigation of Ar incident energy and Ar incident angle effects on surface roughness of Cu metallic thin film in ion assisted deposition: Fid-Bau Portal

Investigation of Ar incident energy and Ar incident angle effects on surface roughness of Cu metallic thin film in ion assisted deposition

Su, M. H. / Lu, J. M.

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Investigation of Ar incident energy and Ar incident angle effects on surface roughness of Cu metallic thin film in ion assisted deposition

Su, M. H. / Lu, J. M.

Investigation of Ar incident energy and Ar incident angle effects on surface roughness of Cu metallic thin film in ion assisted deposition

Su, M. H. / Lu, J. M.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Titel:

Investigation of Ar incident energy and Ar incident angle effects on surface roughness of Cu metallic thin film in ion assisted deposition

Beteiligte:

Su, M. H. (Autor:in) / Lu, J. M. (Autor:in)

Erschienen in:

COMPUTATIONAL MATERIALS SCIENCE ; 38 ; 386-394

Erscheinungsdatum:

01.01.2006

Format / Umfang:

9 pages

ISSN:

0927-0256

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.1 / 510

Yingchun, S. / Jiujun, X. / Xiaodong, H. | British Library Online Contents | 2007

Layer-plus-wire growth of copper by small incident angle deposition

Su, J. B. / Li, X. X. / Jiang, M. P. et al. | British Library Online Contents | 2013

Controlling energy deposition during the C60+ bombardment of silicon: The effect of incident angle geometry

Kozole, J. / Winograd, N. | British Library Online Contents | 2008

CCPS Guidelines for Incident Investigation

Brown, B. / American Petroleum Institute | British Library Conference Proceedings | 1996

Incident Occurrence Models for Freeway Incident Management

Konduri, S. / Labi, S. / Sinha, K. C. | British Library Online Contents | 2003

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