Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Phase transformation of Ni-B, Ni-P diffusion barrier deposited electrolessly on Cu interconnect
Phase transformation of Ni-B, Ni-P diffusion barrier deposited electrolessly on Cu interconnect
Phase transformation of Ni-B, Ni-P diffusion barrier deposited electrolessly on Cu interconnect
Choi, J. W. (Autor:in) / Hwang, G. H. (Autor:in) / Han, W. K. (Autor:in) / Kang, S. G. (Autor:in)
APPLIED SURFACE SCIENCE ; 253 ; 2171-2178
01.01.2006
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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