Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier
Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier
Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier
Kim, J. S. (Autor:in) / Kang, S.-G. / Kobayashi, T.
01.01.2004
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Effects of heat treatment on electroless copper-deposited film in TaN diffusion barrier
| British Library Online Contents | 2003
Phase transformation of Ni-B, Ni-P diffusion barrier deposited electrolessly on Cu interconnect
| British Library Online Contents | 2006
Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
| British Library Online Contents | 2017
Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
| British Library Online Contents | 2017
Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
| British Library Online Contents | 2017