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Phase transformation of Ni-B, Ni-P diffusion barrier deposited electrolessly on Cu interconnect
Phase transformation of Ni-B, Ni-P diffusion barrier deposited electrolessly on Cu interconnect
Phase transformation of Ni-B, Ni-P diffusion barrier deposited electrolessly on Cu interconnect
Choi, J. W. (author) / Hwang, G. H. (author) / Han, W. K. (author) / Kang, S. G. (author)
APPLIED SURFACE SCIENCE ; 253 ; 2171-2178
2006-01-01
8 pages
Article (Journal)
English
DDC:
621.35
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