Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging
Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging
Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging
Liu, C. M. (Autor:in) / Lee, C. C. (Autor:in) / Ku, H. T. (Autor:in) / Chiu, C. C. (Autor:in) / Chiang, K. N. (Autor:in) / Lee, S.-B. / Kim, Y.-J.
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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