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Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging

Liu, C. M. / Lee, C. C. / Ku, H. T. / Chiu, C. C. / Chiang, K. N.

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Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging

Liu, C. M. / Lee, C. C. / Ku, H. T. / Chiu, C. C. / Chiang, K. N.

Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging

Liu, C. M. / Lee, C. C. / Ku, H. T. / Chiu, C. C. / Chiang, K. N.

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Check availability in my library

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Document information

Title:

Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging

Contributors:

Liu, C. M. (author) / Lee, C. C. (author) / Ku, H. T. (author) / Chiu, C. C. (author) / Chiang, K. N. (author) / Lee, S.-B. / Kim, Y.-J.

Published in:

Experimental Mechanics in Nano and Biotechnology ; 521-524

KEY ENGINEERING MATERIALS ; 326/328

Publication date:

2006-01-01

Size:

4 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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