Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging
Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging
Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging
Felba, J. (Autor:in) / Falat, T. (Autor:in) / Wymyslowski, A. (Autor:in)
MATERIALS SCIENCE -WROCLAW- ; 25 ; 45-56
01.01.2007
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
| British Library Online Contents | 2010
Effect of thermal exposure on the mechanical properties of polymer adhesives
| British Library Online Contents | 2017
Effect of thermal exposure on the mechanical properties of polymer adhesives
| Online Contents | 2017
Future packaging: Market forecasts for microelectronic packaging
British Library Online Contents | 2009
Aluminum Nitride for Microelectronic Packaging
British Library Online Contents | 1994