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    Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging

    New search for: Felba, J.
    New search for: Falat, T.
    New search for: Wymyslowski, A.

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    Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging

    New search for: Felba, J.
    New search for: Falat, T.
    New search for: Wymyslowski, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging

    New search for: Felba, J.
    New search for: Falat, T.
    New search for: Wymyslowski, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging

    Contributors:

    Felba, J. (author) / Falat, T. (author) / Wymyslowski, A. (author)

    Published in:

    MATERIALS SCIENCE -WROCLAW- ; 25 ; 45-56

    Publication date:

    2007-01-01

    Size:

    12 pages

    ISSN:

    0137-1339

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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