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Deformation and fracture behavior of electrocodeposited alumina nanoparticle/copper composite films
Deformation and fracture behavior of electrocodeposited alumina nanoparticle/copper composite films
Deformation and fracture behavior of electrocodeposited alumina nanoparticle/copper composite films
Gan, Y. X. (Autor:in) / Wei, C. S. (Autor:in) / Lam, M. (Autor:in) / Wei, X. (Autor:in) / Lee, D. (Autor:in) / Kysar, J. W. (Autor:in) / Chen, X. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 42 ; 5256-5263
01.01.2007
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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