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Electropotential-stimulated wear of copper during chemical mechanical planarization
Electropotential-stimulated wear of copper during chemical mechanical planarization
Electropotential-stimulated wear of copper during chemical mechanical planarization
Kulkarni, M. (Autor:in) / Ng, D. (Autor:in) / Baker, M. (Autor:in) / Liang, H. (Autor:in) / Her, R. (Autor:in)
WEAR -LAUSANNE- ; 263 ; 1470-1476
01.01.2007
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11292
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