Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
APPLIED SURFACE SCIENCE ; 293 ; 287-292
01.01.2014
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
British Library Online Contents | 2014
|Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
British Library Online Contents | 2014
|Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry
British Library Online Contents | 2004
|Electropotential-stimulated wear of copper during chemical mechanical planarization
British Library Online Contents | 2007
|Electropotential-stimulated wear of copper during chemical mechanical planarization
British Library Online Contents | 2007
|