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Electropotential-stimulated wear of copper during chemical mechanical planarization

Kulkarni, M. / Ng, D. / Baker, M. / Liang, H. / Her, R.

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Electropotential-stimulated wear of copper during chemical mechanical planarization

Kulkarni, M. / Ng, D. / Baker, M. / Liang, H. / Her, R.

Electropotential-stimulated wear of copper during chemical mechanical planarization

Kulkarni, M. / Ng, D. / Baker, M. / Liang, H. / Her, R.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Electropotential-stimulated wear of copper during chemical mechanical planarization

Contributors:

Kulkarni, M. (author) / Ng, D. (author) / Baker, M. (author) / Liang, H. (author) / Her, R. (author)

Published in:

WEAR -LAUSANNE- ; 263 ; 1470-1476

Publication date:

2007-01-01

Size:

7 pages

ISSN:

0043-1648

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11292

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