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Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires
Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires
Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires
Lee, J. (Autor:in) / Mayer, M. (Autor:in) / Zhou, Y. (Autor:in) / Hong, S.J. (Autor:in) / Lee, S.M. (Autor:in) / Lee, C. / Lee, J.-B. / Park, D.-H. / Na, S.-J.
01.01.2008
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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