Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
Jeong, J.S. (Autor:in) / Yim, B.-S. (Autor:in) / Oh, S.H. (Autor:in) / Song, H. (Autor:in) / Lee, B.H. (Autor:in) / Kim, J.-M. (Autor:in)
MATERIALS TRANSACTIONS ; 53 ; 2097-2103
01.01.2012
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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