Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints: Fid-Bau Portal

Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints

Gu, X. / Yang, D. / Chan, Y.C. / Wu, B.Y.

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Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints

Gu, X. / Yang, D. / Chan, Y.C. / Wu, B.Y.

Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints

Gu, X. / Yang, D. / Chan, Y.C. / Wu, B.Y.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints

Beteiligte:

Gu, X. (Autor:in) / Yang, D. (Autor:in) / Chan, Y.C. (Autor:in) / Wu, B.Y. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 2591-2596

Erscheinungsdatum:

01.01.2008

Format / Umfang:

6 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Sun, J. / Xu, G. / Guo, F. et al. | British Library Online Contents | 2011

Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints

He, H. / Xu, G. / Guo, F. | British Library Online Contents | 2010

Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test

Wang, F. / Huang, Y. / Du, C. | British Library Online Contents | 2016

Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

He, H. / Xu, G. / Guo, F. | British Library Online Contents | 2009

Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Chen, H.-Y. / Chen, C. | British Library Online Contents | 2011

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