Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints: Fid-Bau Portal

Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Chen, H.-Y. / Chen, C.

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Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Chen, H.-Y. / Chen, C.

Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Chen, H.-Y. / Chen, C.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Beteiligte:

Chen, H.-Y. (Autor:in) / Chen, C. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 983-991

Erscheinungsdatum:

01.01.2011

Format / Umfang:

9 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Basaran, C. / Abdulhamid, M. F. | British Library Online Contents | 2009

Thermomigration in lead-free solder joints

Abdulhamid, M.F. / Li, S. / Basaran, C. | British Library Online Contents | 2008

Thermomigration in lead-free solder joints

Abdulhamid, Mohd F. / Li, Shidong / Basaran, Cemal | British Library Online Contents | 2008

Thermomigration in solder joints

Chen, C. / Hsiao, H. Y. / Chang, Y. W. et al. | British Library Online Contents | 2012

Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. et al. | British Library Online Contents | 2005

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