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Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization
Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization
Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization
Qin, N. (Autor:in) / Guo, D.M. (Autor:in) / Kang, R.K. (Autor:in) / Huo, F.W. (Autor:in)
KEY ENGINEERING MATERIALS ; 389/390 ; 498-503
01.01.2009
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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