The reflectivity of Mo/Ag/Au ohmic contacts on p-type GaN for flip-chip light-emitting diode (FCLED) applications

Jeng, M. J. / Shiue, C. C. / Chang, L. B. | British Library Online Contents | 2008

Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

Hwang, Y. T. / Hong, H. G. / Seong, T. Y. et al. | British Library Online Contents | 2007

Junction temperature and reliability of high-power flip-chip light emitting diodes

Chen, Z. Z. / Liu, P. / Qi, S. L. et al. | British Library Online Contents | 2007

Effect of Pt and Ti on Ni/Ag/(Pt or Ti)/Au p-ohmic contacts of GaN based flip-chip LEDs

Song, H. J. / Roh, C. H. / Choi, H. G. et al. | British Library Online Contents | 2011

Electrical characteristics of In/ITO p-type ohmic contacts for high-performance GaN-based light-emitting diodes

Oh, J.-H. / Kim, K.-K. / Hong, H.-G. et al. | British Library Online Contents | 2010