Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Junction temperature and reliability of high-power flip-chip light emitting diodes
Junction temperature and reliability of high-power flip-chip light emitting diodes
Junction temperature and reliability of high-power flip-chip light emitting diodes
Chen, Z. Z. (Autor:in) / Liu, P. (Autor:in) / Qi, S. L. (Autor:in) / Lin, L. (Autor:in) / Pan, H. P. (Autor:in) / Qin, Z. X. (Autor:in) / Yu, T. J. (Autor:in) / He, Z. K. (Autor:in) / Zhang, G. Y. (Autor:in)
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 10 ; 206-210
01.01.2007
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Vibration Reliability in Flip Chip Package
| British Library Online Contents | 2005
| British Library Online Contents | 2010
Flip Chip PBGAs Assess FPBGA Package Reliability
| British Library Online Contents | 2003
UNDERWATER APPLICATION OF HIGH-POWER LIGHT-EMITTING DIODES
| British Library Online Contents | 2007
Flip Chip PBGAs Board-level Reliability and Testing
| British Library Online Contents | 2003