Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review: Fid-Bau Portal

Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

Cong, W.L. / Zhang, P.F. / Pei, Z.J.

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Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

Cong, W.L. / Zhang, P.F. / Pei, Z.J.

Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

Cong, W.L. / Zhang, P.F. / Pei, Z.J.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Dokumentinformationen

Titel:

Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

Beteiligte:

Cong, W.L. (Autor:in) / Zhang, P.F. (Autor:in) / Pei, Z.J. (Autor:in) / Xu, X.

Erschienen in:

Progress in Abrasive and Grinding Technology ; 23-32

KEY ENGINEERING MATERIALS ; 404

Erscheinungsdatum:

01.01.2009

Format / Umfang:

10 pages

ISSN:

1013-9826

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Lu, C.D. / Qian, D.M. / Jiang, S.F. | British Library Online Contents | 2009

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Li, Y. / Kang, R. / Gao, H. et al. | British Library Online Contents | 2010

Thinning of Lithium Niobate Wafers with a Novel Designed Lapping Tool and Measurements

Du, W.-l. / Liang, T. / Xue, C.-y. et al. | British Library Online Contents | 2010

Research on Material Removal Characteristics in Plane Lapping Method for Aspherical Surface Using Elastic Deformation

Wu, Z. / Yuan, J.L. / Lv, B.H. et al. | British Library Online Contents | 2011

Development of Lapping and Polishing Technologies of 4H-SiC Wafers for Power Device Applications

Yoshiro, H. / Fujimoto, T. / Ohtani, N. et al. | British Library Online Contents | 2009

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