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    Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

    New search for: Cong, W.L.
    New search for: Zhang, P.F.
    New search for: Pei, Z.J.
    New search for: Xu, X.

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    Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

    New search for: Cong, W.L.
    New search for: Zhang, P.F.
    New search for: Pei, Z.J.
    New search for: Xu, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

    New search for: Cong, W.L.
    New search for: Zhang, P.F.
    New search for: Pei, Z.J.
    New search for: Xu, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Experimental Investigations on Material Removal Rate and Surface Roughness in Lapping of Substrate Wafers: A Literature Review

    Contributors:

    Cong, W.L. (author) / Zhang, P.F. (author) / Pei, Z.J. (author) / Xu, X.

    Published in:

    Progress in Abrasive and Grinding Technology ; 23-32

    KEY ENGINEERING MATERIALS ; 404

    Publication date:

    2009-01-01

    Size:

    10 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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