Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Post Annealing Etch Process for Improved Reverse Characteristics of 4H-SiC Diode
Post Annealing Etch Process for Improved Reverse Characteristics of 4H-SiC Diode
Post Annealing Etch Process for Improved Reverse Characteristics of 4H-SiC Diode
Kang, I.H. (Autor:in) / Bahng, W. (Autor:in) / Joo, S.J. (Autor:in) / Kim, S.C. (Autor:in) / Kim, N.K. (Autor:in)
MATERIALS SCIENCE FORUM ; 615/617 ; 663-666
01.01.2009
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Reverse Characteristics of a 4H-SiC Schottky Barrier Diode
British Library Online Contents | 2002
|Improved Characteristics of SiC MOSFETs by Post-Oxidation Annealing in Ar at High Temperature
British Library Online Contents | 2011
|Post-treatment process for reverse osmosis membranes
Tema Archiv | 1981
|British Library Online Contents | 2013
|Etch characteristics of HfO2 films on Si substrates
British Library Online Contents | 2002
|