Probing lead-free solders in electronics: Characterising alloys of tin, silver and copper for improved reliability: Fid-Bau Portal

Probing lead-free solders in electronics: Characterising alloys of tin, silver and copper for improved reliability

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Probing lead-free solders in electronics: Characterising alloys of tin, silver and copper for improved reliability

Zugriff

Seitennavigation

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Probing lead-free solders in electronics: Characterising alloys of tin, silver and copper for improved reliability

Erschienen in:

MATERIALS WORLD ; 17 ; 14

Erscheinungsdatum:

01.01.2009

Format / Umfang:

14 pages

ISSN:

0967-8638

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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