A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP): Fid-Bau Portal

A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

Abdullah, M.K. / Abdullah, M.Z. / Mujeebu, M.A. / Kamaruddin, S. / Ariff, Z.M.

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A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

Abdullah, M.K. / Abdullah, M.Z. / Mujeebu, M.A. / Kamaruddin, S. / Ariff, Z.M.

A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

Abdullah, M.K. / Abdullah, M.Z. / Mujeebu, M.A. / Kamaruddin, S. / Ariff, Z.M.

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Verfügbarkeit in meiner Bibliothek prüfen

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Ähnliche Titel

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Titel:

A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

Beteiligte:

Abdullah, M.K. (Autor:in) / Abdullah, M.Z. (Autor:in) / Mujeebu, M.A. (Autor:in) / Kamaruddin, S. (Autor:in) / Ariff, Z.M. (Autor:in)

Erschienen in:

JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 28 ; 2527-2538

Erscheinungsdatum:

01.01.2009

Format / Umfang:

12 pages

ISSN:

0731-6844

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.1923

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