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Influence of interfaces density and thermal processes on mechanical stress of PECVD silicon nitride
Influence of interfaces density and thermal processes on mechanical stress of PECVD silicon nitride
Influence of interfaces density and thermal processes on mechanical stress of PECVD silicon nitride
Picciotto, A. (Autor:in) / Bagolini, A. (Autor:in) / Bellutti, P. (Autor:in) / Boscardin, M. (Autor:in)
APPLIED SURFACE SCIENCE ; 256 ; 251-255
01.01.2009
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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