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The Microstructure and Mechanical Properties of SiCp-reinforced Copper Matrix Composites by Hot Pressing
The Microstructure and Mechanical Properties of SiCp-reinforced Copper Matrix Composites by Hot Pressing
The Microstructure and Mechanical Properties of SiCp-reinforced Copper Matrix Composites by Hot Pressing
Wang, C. (Autor:in) / Min, G. (Autor:in) / Kang, S.-B. (Autor:in)
JOURNAL OF COMPOSITE MATERIALS ; 44 ; 347-354
01.01.2010
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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