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    The Microstructure and Mechanical Properties of SiCp-reinforced Copper Matrix Composites by Hot Pressing

    New search for: Wang, C.
    New search for: Min, G.
    New search for: Kang, S.-B.

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    The Microstructure and Mechanical Properties of SiCp-reinforced Copper Matrix Composites by Hot Pressing

    New search for: Wang, C.
    New search for: Min, G.
    New search for: Kang, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The Microstructure and Mechanical Properties of SiCp-reinforced Copper Matrix Composites by Hot Pressing

    New search for: Wang, C.
    New search for: Min, G.
    New search for: Kang, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    The Microstructure and Mechanical Properties of SiCp-reinforced Copper Matrix Composites by Hot Pressing

    Contributors:

    Wang, C. (author) / Min, G. (author) / Kang, S.-B. (author)

    Published in:

    JOURNAL OF COMPOSITE MATERIALS ; 44 ; 347-354

    Publication date:

    2010-01-01

    Size:

    8 pages

    ISSN:

    0021-9983

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.118

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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