Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Intermediate Oxide Layers for Direct Bonding of Copper (DBC) to Aluminum Nitride Ceramic Substrates
Intermediate Oxide Layers for Direct Bonding of Copper (DBC) to Aluminum Nitride Ceramic Substrates
Intermediate Oxide Layers for Direct Bonding of Copper (DBC) to Aluminum Nitride Ceramic Substrates
Molisani, A.L. (Autor:in) / Yoshimura, H.N. (Autor:in) / Salgado, L. / Filho, F.A.
01.01.2010
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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