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Direct bonding of copper to aluminum nitride
Direct bonding of copper to aluminum nitride
Direct bonding of copper to aluminum nitride
Entezarian, M. (Autor:in) / Drew, R. A. L. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 212 ; 206-212
01.01.1996
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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