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    Intermediate Oxide Layers for Direct Bonding of Copper (DBC) to Aluminum Nitride Ceramic Substrates

    New search for: Molisani, A.L.
    New search for: Yoshimura, H.N.
    New search for: Salgado, L.
    New search for: Filho, F.A.

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    Intermediate Oxide Layers for Direct Bonding of Copper (DBC) to Aluminum Nitride Ceramic Substrates

    New search for: Molisani, A.L.
    New search for: Yoshimura, H.N.
    New search for: Salgado, L.
    New search for: Filho, F.A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Intermediate Oxide Layers for Direct Bonding of Copper (DBC) to Aluminum Nitride Ceramic Substrates

    New search for: Molisani, A.L.
    New search for: Yoshimura, H.N.
    New search for: Salgado, L.
    New search for: Filho, F.A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Intermediate Oxide Layers for Direct Bonding of Copper (DBC) to Aluminum Nitride Ceramic Substrates

    Contributors:

    Molisani, A.L. (author) / Yoshimura, H.N. (author) / Salgado, L. / Filho, F.A.

    Published in:

    Advanced Powder Technology VII ; 658-666

    MATERIALS SCIENCE FORUM ; 660/661

    Publication date:

    2010-01-01

    Size:

    9 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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