Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Application and Prospects of Packaging Technology of MEMS
Application and Prospects of Packaging Technology of MEMS
Application and Prospects of Packaging Technology of MEMS
Feng, X.Z. (Autor:in) / Chen, L.J. (Autor:in) / Cheng, J.W. (Autor:in) / Wu, Y.
01.01.2011
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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