Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Wafer-level MEMS packaging
Wafer-level MEMS packaging
Wafer-level MEMS packaging
Parton, E. (Autor:in) / Tilmans, H. (Autor:in)
ADVANCED PACKAGING ; 11 ; 21-24
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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