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Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder
Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder
Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder
Ramirez, M. (Autor:in) / Henneken, L. (Autor:in) / Virtanen, S. (Autor:in)
APPLIED SURFACE SCIENCE ; 257 ; 6481-6488
01.01.2011
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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