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Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Cordill, M.J. (Autor:in) / Taylor, A. (Autor:in) / Schalko, J. (Autor:in) / Dehm, G. (Autor:in)
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 102 ; 729-734
01.01.2011
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
669.9
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