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Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Cordill, M.J. (author) / Taylor, A. (author) / Schalko, J. (author) / Dehm, G. (author)
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 102 ; 729-734
2011-01-01
6 pages
Article (Journal)
English
DDC:
669.9
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