Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers
Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers
Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers
Li, K.H. (Autor:in) / Guo, Q. (Autor:in) / Liu, M.Y. (Autor:in) / Zhao, Y.J. (Autor:in) / Shi, D.L. (Autor:in)
KEY ENGINEERING MATERIALS ; 487 ; 169-174
01.01.2011
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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