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Ultraprecision grinding of silicon wafers using a newly developed diamond wheel
Ultraprecision grinding of silicon wafers using a newly developed diamond wheel
Ultraprecision grinding of silicon wafers using a newly developed diamond wheel
Zhou, Hongxiu (Autor:in) / Guo, Miao (Autor:in) / Wang, Xinze (Autor:in)
Materials science in semiconductor processing ; 68 ; 238-244
01.01.2017
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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