A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers
Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers
Influence of Pore-Forming Agent on the Performance of Resin Bond Diamond Grinding Wheel in Back-Grinding Silicon Wafers
Li, K.H. (author) / Guo, Q. (author) / Liu, M.Y. (author) / Zhao, Y.J. (author) / Shi, D.L. (author)
KEY ENGINEERING MATERIALS ; 487 ; 169-174
2011-01-01
6 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Ultraprecision grinding of silicon wafers using a newly developed diamond wheel
| British Library Online Contents | 2017
| British Library Online Contents | 2007
| European Patent Office | 2016
Performance of Laser Brazing Diamond Grinding Wheel in Face Grinding
| British Library Online Contents | 2011
Modeling of Laser Dressing for Metal-Bond Diamond Grinding Wheel
| British Library Online Contents | 2007