Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Process for Cu - Sn Alloy Electroplating in Pyrophosphate Bath and Function of Auxiliary Complexing Agent
Process for Cu - Sn Alloy Electroplating in Pyrophosphate Bath and Function of Auxiliary Complexing Agent
Process for Cu - Sn Alloy Electroplating in Pyrophosphate Bath and Function of Auxiliary Complexing Agent
Feng, S.-b. (Autor:in) / Su, C. (Autor:in) / Cheng, S. (Autor:in) / Li, H.-d. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 44 ; 34-37
01.01.2011
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Process for Electroplating of Copper in Pyrophosphate Bath
British Library Online Contents | 2006
|Process for Electroplating of Copper in Pyrophosphate Bath
British Library Online Contents | 2006
|Process for Electroplating of Copper in Pyrophosphate Bath
British Library Online Contents | 2006
|New Alkaline Copper Electroplating Bath Based on an Inorganic Complexing Agent
British Library Online Contents | 2006
|Additives of Pyrophosphate Bath for Electroplating of Cu-Sn Alloy Coating
British Library Online Contents | 2011
|