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Stress evolution in copper-silver thin films during thermal-cycling
Stress evolution in copper-silver thin films during thermal-cycling
Stress evolution in copper-silver thin films during thermal-cycling
Chama, C. C. (Autor:in) / Vlassak, J. J. (Autor:in) / Soboyejo, W. O. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 532 ; 414-419
01.01.2012
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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