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Stress evolution in copper-silver thin films during thermal-cycling

Chama, C. C. / Vlassak, J. J. / Soboyejo, W. O.

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Stress evolution in copper-silver thin films during thermal-cycling

Chama, C. C. / Vlassak, J. J. / Soboyejo, W. O.

Stress evolution in copper-silver thin films during thermal-cycling

Chama, C. C. / Vlassak, J. J. / Soboyejo, W. O.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Stress evolution in copper-silver thin films during thermal-cycling

Contributors:

Chama, C. C. (author) / Vlassak, J. J. (author) / Soboyejo, W. O. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 532 ; 414-419

Publication date:

2012-01-01

Size:

6 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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