Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

Zhang, R. / Tian, Y. / Hang, C. et al. | British Library Online Contents | 2013

Computational investigation of intermetallic compounds (Cu6Sn5 and Cu3Sn) growth during solid-state aging process

Park, M. S. / Arroyave, R. | British Library Online Contents | 2011

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Yang, P. F. / Lai, Y. S. / Jian, S. R. et al. | British Library Online Contents | 2008

Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures

Chiu, Wei-Lan / Liu, Chien-Min / Haung, Yi-Sa et al. | British Library Online Contents | 2016

Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation

Cheng, H. C. / Yu, C. F. / Chen, W. H. | British Library Online Contents | 2012