Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

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Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad

Tso, P.L. / Shih, C.Y. | British Library Online Contents | 2009

Material removal model for chemical-mechanical polishing considering wafer flexibility and edge effects

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2004

Multiscale material removal modeling of chemical mechanical polishing

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2003

A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer

Li, W. / Hu, X. D. / Jin, Y. F. et al. | British Library Online Contents | 2007